CUNY ASRC NanoFabrication Facility Equipment
Wire Bonder (West Bond 454647E)
The West Bond wire bonder is a semi-automatic wire bonder that can accommodate both wedge and ball bonding to interconnect aluminum or gold wire leads to devices. Three ultrasonic bonding methods can be executed; wedge bonding with angled wire feed for best loop control, wedge bonding with vertical feed for access to deep workpieces, selected by exchanging only the clamp assemblies; and ball bonding of gold wire with electronic flame off, selected by exchanging tool assemblies.
Access Instructions
Contact the CUNY Advanced Science Research Center NanoFabrication Facility at nanofab@asrc.cuny.edu with inquiries. Potential new users can visit http://nanofab.asrc.cuny.edu/become-a-member/ for instructions on becoming a qualified user.
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a member of CUNY ASRC NanoFabrication Facility, a member of a group partnered with this group, or
affiliated with the resource owner.
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