The Oxford PlasmaPro NPG80 RIE is an open-load medium plasma density system configured for fluorine-based etch chemistries, which can accommodate pieces to wafers up to 8” in diameter and 3 cm thick. This tool is configured with a fluorine chemistry to etch silicon, its oxides and nitrides, and polymers including photoresist and silicone elastomers. The system has a 300 W 13.56 MHz RF power source coupled to a solid state matching network. The active electrode is equipped with a heater/chiller and is capable of operating at temperatures varying from 0_C to +80_C.
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