CUNY ASRC NanoFabrication Facility Equipment
Reactive Ion Etcher (Oxford PlasmaPro NPG80 RIE )
The Oxford PlasmaPro NPG80 RIE is an open-load medium plasma density system configured for fluorine-based etch chemistries, which can accommodate pieces to wafers up to 8” in diameter and 3 cm thick. This tool is configured with a fluorine chemistry to etch silicon, its oxides and nitrides, and polymers including photoresist and silicone elastomers. The system has a 300 W 13.56 MHz RF power source coupled to a solid state matching network. The active electrode is equipped with a heater/chiller and is capable of operating at temperatures varying from 0_C to +80_C.
Access Instructions
Contact the CUNY Advanced Science Research Center NanoFabrication Facility at nanofab@asrc.cuny.edu with inquiries. Potential new users can visit http://nanofab.asrc.cuny.edu/become-a-member/ for instructions on becoming a qualified user.
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To gain access you must be
a member of CUNY ASRC NanoFabrication Facility, a member of a group partnered with this group, or
affiliated with the resource owner.
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