The Oxford PlasmaPro System 100 PECVD is load locked tool, capable of depositing silicon oxide, silicon nitride, amorphous silicon, and other films (under staff permission). The PECVD has a 600W 13.56 MHz plasma source and has an electrically heated lower electrode, capable of a maximum temperature of 400C. Additionally, the system has a 100kHz low frequency generator connected to the top electrode. The tool is capable of processing wafers up to 8” in diameter, down to smaller wafers and chips.
Contact the CUNY Advanced Science Research Center NanoFabrication Facility at email@example.com with inquiries. Potential new users can visit http://nanofab.asrc.cuny.edu/become-a-member/ for instructions on becoming a qualified user.
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