CUNY ASRC NanoFabrication Facility Equipment

Inductively Coupled Plasma Reactive Ion Etcher 2 (Oxford PlasmaPro System 100 Cobra)

The Oxford PlasmaPro System 100 Cobra is a load-locked high plasma density system which can accommodate pieces to wafers up to 6” in diameter. The system is configured for Fluorine-based etching, including a variety of silicon based materials and various dielectrics. The system has a 600 W 13.56 MHz RF power source coupled to a solid state matching network. The active electrode is equipped with a heater/chiller and is capable of operating at temperatures varying from 0C to +80C. The Cobra process chamber walls are fitted with an electrical heating kit, allowing for warming to approximately 80C. The system is also configured with a deep reactive ion etching mode.