The Oxford PlasmaPro System 100 Cobra is a load-locked high plasma density system which can accommodate pieces to wafers up to 6” in diameter. The system is configured for Fluorine-based etching, including a variety of silicon based materials and various dielectrics. The system has a 600 W 13.56 MHz RF power source coupled to a solid state matching network. The active electrode is equipped with a heater/chiller and is capable of operating at temperatures varying from 0C to +80C. The Cobra process chamber walls are fitted with an electrical heating kit, allowing for warming to approximately 80C. The system is also configured with a deep reactive ion etching mode.
Contact the CUNY Advanced Science Research Center NanoFabrication Facility at nanofab@asrc.cuny.edu with inquiries. Potential new users can visit http://nanofab.asrc.cuny.edu/become-a-member/ for instructions on becoming a qualified user.
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